This is the new CuttingMaster 2246
The new CuttingMaster 2246 expands LPKF's depaneling portfolio with another system variant, adding a new highlight featuring the disruptive Tensor Technology. The variant is based on the field- proven CuttingMaster 2000 platform, which is particularly notable for its great reliability, high precision, and small footprint.
Like all other LPKF depaneling systems, the new CuttingMaster 2246 is available in both manual (P) and automated (Ci) versions. The Ci systems can be seamlessly integrated into SMT lines and highly automated handling solutions. The degree of automation can be designed according to customer requirements and can also be flexibly scaled retrospectively.
By using specially developed laser sources and software solutions, LPKF has two central components of the systems under its own control. The resulting synergy effects and added value in process know-how and control can be passed on to customers in the form of corresponding performance gains and the associated competitive advantage.
The market wide best price performance ratio
The new system variant sets new standards in the market and offers customers by far the best price-performance ratio. Depending on the application, the CuttingMaster 2246 can achieve increases in effective cutting speed of over 20% across all quality levels.
The use of the Tensor noticeably improves the cutting edge quality of the singulated printed circuit boards, as the otherwise required cooling times are no longer necessary. This is the case beacuse the Tensor - an ultra-fast beam deflection system - distributes the pulses around the spot in a targeted manner, allowing the energy to be used more broadly and intelligently. With increasing material thicknesses and especially for technically clean cuts, such as LPKF CleanCut, the added value of the Tensor continues to increase, because in such cases, cycle times can be reduced by up to 70% with the Tensor!
This should be particularly interesting for customers who still mill, saw, or manually separate their PCB panels for economic reasons. The laser is now more than equal in terms of cost-effectiveness and has apart from that a number of further technological advantages, such as unmatched technical cleanliness as well as maximum precision and stress-free processing.
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