LASER DEPANELING

LPKF CuttingMaster 3290

Best performance at low cost!

LPKF CuttingMaster 3290

The Next Generation of Laser Depaneling

Double performance and the longest laser life time with the highest quality: The CuttingMaster 3290 with Tensor Technology makes laser depaneling a highly cost-effective alternative even for thicker FR4 materials - more compact and affordable than ever before.

This is the pioneering CuttingMaster 3290:

The CuttingMaster 3290 represents a technological leap forward in laser depaneling. 90 watts of laser power, combined with innovative Tensor Technology, doubles performance in FR4 applications and enables highly cost-effective cutting of even thick substrates exceeding 2.4 mm in PCB thickness. With a laser source lifespan of up to 10 years, the system sets new standards for running costs - all while offering a significantly more compact footprint and a more attractive price-performance ratio than dual-head systems.

For maximum flexibility, the CuttingMaster 3290 is available both as a manually operated version (P) and as a fully integrable automation solution (Ci). The manual version can be upgraded to an automated system depending on the production strategy and growth plan - ideal for companies that want to start manually and automate gradually later on. In general, the system is designed for 24/7 series production. With a potential component height of up to 40 mm, the CuttingMaster 3290 quickly, precisely, and gently cuts even densely populated double-sided assemblies. Automated systems can be seamlessly integrated into existing production lines, and the degree of automation is flexibly scalable according to customer requirements.

The perfectly synchronized synergy between the laser source, Tensor Technology, and powerful software optimizes heat input and enables the full laser power to be utilized - delivering exceptionally clean, burr-free cut edges, even with the most challenging materials and complex PCB designs.

Milling is history – the CuttingMaster 3290 makes the difference

Highly attractive price-performance ratio

The CuttingMaster 3290 has been designed with a consistent focus on productivity and cost per assembly. Its high laser performance, combined with optimized process flows, results in significantly shorter cycle times and thus a noticeable reduction in unit costs - especially when compared directly to traditional milling processes. Added to this are minimal follow-up costs: the long-lasting laser sources, the extremely low maintenance requirements, and the high system availability keep operating costs permanently low. At the same time, the outstanding process stability ensures less scrap, no rework, and thus more saleable units with the same line capacity.

The system is based on the CuttingMaster 3000 platform, which has proven itself time and again in practice and has been further refined in the CuttingMaster 3290: compact in footprint, straightforward in design, and clearly focused on maximum output without unnecessary complexity. Compared to traditional dual-head laser concepts, higher productivity is achieved with significantly less additional expenditure – meaning fewer sources of error and shorter downtime. The result is a solution that impresses technologically and excites economically: higher yield, lower operating costs, and an investment that pays for itself quickly thanks to increased performance.

 Downloads

Brochure LPKF CuttingMaster Series
LPKF CuttingMaster 2000 & 3000 (pdf - 724 KB)
Download

 Do you have any questions or would you like to request a sample?

Your Contact Data

Your Message

I agree to the processing of my data pursuant to the Privacy Statement.

* Required fields
Logo: LASER DEPANELING  LPKF Laser & Electronics

I agree to receive other notifications from LPKF.

I agree to the storage and processing of my personal data by LPKF.

Logo: LASER DEPANELING  LPKF Laser & Electronics