LPKF MicroLine 2000

Cutting printed circuit boards and panels with UV-laser

LPKF MicroLine 2000

Compact, powerful and inline-capable

With the optional interfaces, the MicroLine 2000 Ci integrates seamlessly into any existing manufacturing execution systems (MES)


Process advantages through the laser

Compared with conventional tools, laser processing has a number of convincing advantages:

  • The laser process is completely software-controlled. Changes in materials or cutting contours are simply taken into consideration through adjustment of processing parameters and laser paths. Changeover times for production changes are eliminated.
  • Laser cutting with the UV laser does not cause any significant mechanical or thermal stress. The ablation products are extracted directly at the cutting channel. In this way, even sensitive substrates can be precisely processed.
  • The laser beam requires only a few µm as the cutting channel. In this way, more components can be placed on one panel.

  • The system software distinguishes between operation in production and process setup. This significantly reduces operating errors.

Integration in production lines

An integrated SMEMA interface and a newly developed handling system make it possible for customers to integrate the MicroLine 2000 systems into their own production lines. The laser system can cut any contours without mechanical modifications and can handle production runs with a high degree of variance.

Higher throughput

LPKF laser systems can often produce standard-compliant components from distorted base materials. The MicroLine 2000 Ci uses a highly developed vision system that can make corrections to the position and angle of rotation of the component. The laser beam follows the contours of the real component position.

The integrated vision system and the internal infeed have been further optimized on the MicroLine 2000 Ci for the purpose of minimizing non-productive times. In addition, this system can be equipped with a high-power laser source, this further reduces processing times and increases the maximum thickness of the material to be processed.

Integration in MES solutions

With optional interfaces, the MicroLine 2000 Ci integrates seamlessly into any existing manufacturing execution systems (MES). The laser system transfers operating parameters, machine data, tracking & tracing values, and information on individual production runs.

Technical Data

 Manual (P)Automated (Ci)
Max. Working Area350 mm x 350 mm x 11 mm350 mm x 250 mm x 11 mm
Positioning accuracy+/-  25 µm
Diameter of focussed laser beam 20 µm
System dimensions (W x H x D)875 mm x 1550 mm (2000 mm)* x 1120 mm
Weightca. 450 kg


*Height including status light




LPKF MicroLine 2000 Ci Series (pdf - 601 KB)


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