LASER DEPANELING
[Translate to Japanisch:] Automated cutting of printed circuit boards and panels with lasers

Automated Handling

Automated cutting of
printed circuit boards
and panels with lasers.
[Translate to Japanisch:] Automated laser cutting by LPKF: A perfect fit for your application.

Automated Handling

Automated cutting by LPKF:
A perfect fit
for your application.
[Translate to Japanisch:] Automated depaneling with the laser efficient from the start

Automated Handling

Automated depaneling
with the laser
efficient from the start.

Compact, flexible and cost-efficient

Laser depaneling systems from LPKF integrate seamlessly into existing and new production environments as well as Manufacturing Execution Systems (MES). The machines are specially designed for increasing automation and the requirements of industry 4.0.

Modular Automation Solutions

The automation solutions from LPKF are modular and flexible and can be adapted to your individual requirements. The range of solutions extends from the supplementation of single modules to a completely autonomous stand-alone solution for your depaneling process. Of course, an integration into your SMT line can also be implemented without any problems.

SMEMA or optional Hermes interfaces ensure communication with upstream and downstream modules. In addition, LPKF depaneling systems can also be integrated into your MES system as an option, ensuring that not only the production workflow but also the data flow is fully automatic. Thereby the transparency and control of your production can be further optimized.

Application-specific and flexible carrier and gripper solutions contribute to meet the most demanding requirements for accuracy and cycle time. This ensures the handling of large and small as well as assembled and unassembled PCBs in any form and combination. In terms of product diversity, LPKF's solutions also respond to the challenges of mass production of single layouts as well as those of high-mix-low-volume production.

All in all, LPKF's handling solutions are specifically designed for the depaneling process and to satisfy the highest demands for quality, cost efficiency and flexibility, just as they do for the cutting process itself.

Benefits of LPKF Systems

Process benefits of lasers

Especially in case of automated production lines, LPKF machines bring the advantages of laser systems over conventional depaneling tools:

  • The laser process is completely software controlled. Changing materials or cutting contours are simply taken into account by adjusting the processing parameters and laser paths. Changeover times for variant changes are eliminated.­­

  • Laser cutting with lasers does not cause any significant mechanical or thermal stress. The ablation products are extracted directly at the cutting channel. This allows even sensitive substrates to be processed precisely.

  • The laser beam only needs a few µm as a cutting channel. This allows more components to be placed on a panel by eliminiating the wide pathway required by mechanical routers.

  • The system software distinguishes between operation in production and the setup of processes. This significantly reduces operating errors.

 

Integration in production lines

Integrated SMEMA and Hermes interfaces and a newly developed handling system allow the MircoLine 2000 and CuttingMaster systems to be integrated into customer-specific production lines. There they support production managers and machine operators: the laser system can cut any contours without mechanical modifications and allows production runs with a high degree of variance.

Supporting software solutions

LPKF laser systems are equipped with the specially developed software solution CircuitPro. The software enables communication with upstream and downstream production processes, as well as maximum flexibility in PCB production. In addition, the software can also be used to produce standard-compliant components from distorted base materials. The MicroLine 2000 Ci and CuttingMaster Ci systems use highly sophisticated vision systems that can make corrections to the position and angle of rotation of the component. The laser beam follows the contours of the real component position. This integrated vision system and internal infeed have been further optimized for the machines to minimize non-productive time.

Software features:

  • Hermes & SMEMA-interface
  • Multi-Fiducial-Recognition
  • Customer-specific MES-Interfaces
  • Traceability Data & Supervisor Statistics
  • Bad Board Recognition
  • Reading and creation of barcodes

Connection to MES solutions

With the optional interfaces, LPKF's Laser Depaneling systems integrate seamlessly into existing Manufacuting Execution Systems (MES). The laser system transfers operational parameters, machine data, tracking & tracing values and information on individual production processes.

Depaneling System for your Automation Solution

[Translate to Japanisch:] LPKF CuttingMaster 2000 laser depaneling system

Compact and extremely cost-efficient: flexibility, material savings, design freedom - depaneling by laser opens up numerous potentials.

[Translate to Japanisch:] LPKF CuttingMaster 3000 laser depaneling system

The most precise and fastest laser depaneling system with a large working area of up to 460 mm x 305 mm for production-integrated machines.

[Translate to Japanisch:] LPKF MicroLine 2000 laser depaneling system
LPKF MicroLine 2000

Compact, powerful and inline-capable system for cutting printed circuit boards with the laser.


Automated Handling by LPKF


 Downloads

Brochure
LPKF Automation Solutions (pdf - 215 KB)
Download
Brochure
LPKF CuttingMaster Series (pdf - 804 KB)
Download
Brochure
LPKF MicroLine 2000 Ci (pdf - 601 KB)
Download

 Contact

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