Stress-free depaneling of rigid and flexible PCBs

  • Best Performance
  • Robust with long durability
  • High and stable precision
  • High yield in production
Laser depaneling system LPKF CuttingMaster 2000

LPKF CuttingMaster 2000

Redefining PCB Laser Depaneling

Characterized by a compact outer design the CuttingMaster 2000 offers a range of different laser powers and wavelengths for a working area of up to 350 mm x 350 mm. The cost-effective system is capable to use LPKFs CleanCut technology which guarantees a maximum technical cleanliness of the cutting edges.

LPKF CuttingMaster 2000 – The Most Cost-Effective Laser Depaneling System

The compact laser system is ideal for cutting flexible, rigid-flexible and rigid printed circuit boards. Users benefit from the advantages of laser technology: the cuts are precisely positioned, there is a high degree of design freedom, and the surrounding material remains free of mechanical stress. The systems of the LPKF CuttingMaster series are easy to operate thanks to the sophisticated, integrated software. In addition, the compact machines offer a convincing price comparable to that of mechanical cutting systems - without compromising quality, efficiency or flexibility.

Process advantages through the use of lasers

  • The laser process is fully software controlled. Changing materials or cutting contours are simply handled by adjusting the processing parameters and laser paths.
  • Laser cutting with the laser does not cause any significant mechanical or thermal stress. The ablation products are extracted directly at the cutting channel. In this way even sensitive substrates can be precisely processed.
  • The laser beam requires only a few µm as the cutting channel. In this way, more components can be placed on one panel.

Simple operation

  • The LPKF CuttingMaster 2000 series makes depaneling a simple job: The layout files are easily transferred to the machine at the click of a mouse - without lengthy changeover times or previous time-consuming tool production.

High and scalable level of automation

  • Even in the field, the CuttingMaster 2000 systems can be upgraded to an inline system at a later date. In addition, the systems can be supplemented by high-performance and flexible automation solutions and thus unfold their full potential.

Technical Data

 Manual (P)Automated (Ci)
Max. Working Area (X x Y)350 mm x 350 mm350 mm x 250 mm
Positioning accuracy   +/- 25 µm
Diameter of focussed laser beam < 20 µm
System dimensions (W x H x D)875 mm x 1510 mm (2070 mm)* x 1125 mm
Weightca. 450 kg

*Height including status light

Available Variants

Laser powerWavelengthPulse duration2000 seriesCleanCutTensor
22 W355 nm (UV)nano second2122X 
27 W355 nm (UV)nano second2127X 
40 W532 nm (green)nano second2240XX

CuttingMaster 2000 - Redefining the Economics of Laser Depaneling

CuttingMaster 2000 Cx - The next level of Laser Depaneling

The most compact automation for laser depaneling

The LPKF CuttingMaster 2000 Cx offers a compact and cost-efficient automation solution for laser depaneling. Thanks to the integrated handling and optional full automation with a robot, the system saves space and costs. It is particularly suitable for fully automated production lines with high throughput, e.g. as the head of an assembly line.


Image Gallery


LPKF CuttingMaster Systems (pdf - 708 KB)
LPKF CuttingMaster 2000 Series (pdf - 175 KB)
LPKF CuttingMaster 2000 Cx (pdf - 193 KB)

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